Samsung Announce Mass Production Of 2.4Gbps 8GB HBM2 Modules

Samsung Electronics has started mass production of its 2nd-generation 8-gigabyte High Bandwidth Memory-2 with the fastest data transmission speed on the market

Samsung starts producing next-gen HBM2 dubbed Aquabolt

The 8GB Samsung Aquabolt HBM2 will also provide a massive 307 Gbps bandwidth, allowing it to achieve over 9.6 times the data transfer of its 8GB GDDR5 counterpart.

Earlier today, Samsung Electronics announced that the 2nd-generation 8 GB High Bandwidth Memory-2 (HBM2) has entered the mass production stage.

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When it comes to performance, Samsung Electronics' second generation HBM2 memory controller features a "pin speed" of 2.4Gbps at 1.2V.

The new solution, Aquabolt, which is the industry's first HBM2 to deliver a 2.4 gigabits-per-second (Gbps) data transfer speed per pin, should accelerate the expansion of supercomputing and the graphics card market.

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Samsung has also added improvements to the overall structure and design, increasing the thermal bumps between HBM2 dies, for better cooling and adding a new protective layer at the back for increased structural integrity.

In addition, Samsung Electronics has started supplying the Aquabolt to global IT companies and it will strengthen its partnership with supercomputer manufacturers, AI solution developers and graphics firms in the future. The company's second generation HBM2 module (also known as "Aquabolt") now features the fastest DRAM data transmission speeds to date. Samsung used new technologies within their TSV design, as well as tweaks to thermal control. A single 8GB HBM2 package consists of eight 8Gb HBM2 dies, which are vertically interconnected using over 5,000 TSVs (Through Silicon Via's) per die.

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Samsung didn't say when it would be supplying the new memory to partners although if it's already in mass production, one can hope that partner availability won't be too far out. In the research department, Samsung says it'll continue to rapidly advance its memory technology in conjunction with leading OEMs throughout a range of fields including supercomputing, artificial intelligence, and graphics processing.

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